LONDON – Foundry Dongbu HiTek Co. Ltd. has announced it has begun volume production of high dynamic range (HDR) CMOS image sensor (CIS) chips for BYD Microelectronics, a subsidiary of BYD Co. Ltd., a Chinese manufacturer of products ranging from batteries to electric vehicles.
Initially BYD's move into CMOS image sensors will be based on processing at the 130-nm node and target security surveillance applications, including door monitor systems, Dongbu (Seoul, South Korea) said. The high dynamic range specification that BYD has designed into its image sensors will mean that they can image successfully across conditions ranging from direct sunlight to dim moonlight, Dongbu added.
Dongbu said it has technology that is applicable x-ray and endoscope
systems in the medical field, and harsh automotive and industrial
environments. The company plans to processing portfolio with a 5.0
megapixel design. The current average selling price of specialized CMOS imaging sensor devices is up to four times that of CMOS image sensors for camera phone and digital camera applications, the company added.
Dongbu also manufactures for customers using a smart-power BCDMOS process. Dongbu HiTek is currently sampling chips for automotive applications that are implemented with a proprietary 700-V BCDMOS process.
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It looks like they are going after the high end market space (medical, Xray, etc). I wonder what the technical background/history is for the process at the foundry or BYD? Do they have a proven track record at either foundry or BYD for these types of devices? Is this an effort to produce a lower cost (higher margin) device or just an extension of BYD's portfolio? Curious.
I don't know.
I doubt it, although the specification (from sunlight to dim moonlight) sounds extreme. I expect the military have been there first.
I'll ask, but mean time is any others in this forum know for sure, please chip in, pun intend.
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