SAN FRANCISCO—Broadcom Corp. said Monday (Sept. 26) it is sampling the semiconductor industry's first near field communications (NFC) chips built in 40-nm CMOS.
Broadcom (Irvine, Calif.) said its BCM2079x chips support multiple embedded secure elements and/or SIM cards for contactless payment and secure applications. The chips also enable simplified connectivity with Wi-Fi and Bluetooth for new innovations in device-to-device data/video transfer, pairing and connections, Broadcom said.
"We really designed [the BCM2079x family] to be optimized to support multiple SIM cards as well as secure elements," said Craig Ochikubo, vice president and general manager of Broadcom’s wireless personal area networking line of business.
Broadcom said the BCM2079x family reduces power consumption by more than 90 percent, uses 40 percent fewer components and has a 40 percent smaller board area compared to competing products. According to the company, BCM2079x chips are the smallest and most power efficient NFC solutions on the market.
Broadcom did not disclose pricing information for the BCM2079x family , as per company policy. According to Ochikubo, Broadcom is sampling production silicon to customers and working on a number of customer designs, some of which Broadcom anticipates will be in production in the first half of 2012.
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