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Micron, Samsung seek hybrid memory spec

10/7/2011 01:07 AM EDT
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R G.Neale
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re: Micron, Samsung seek hybrid memory spec
R G.Neale   10/7/2011 2:29:34 PM
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This looks like a Samsung Micron challenge to the IBM-3M "Silicon Brick" (TM) project. http://www.eetimes.com/electronics-news/4219712/IBM--3M-to-collaborate-on-3-D-chip-stacking This Chip-to-Brick or Chip-to-Cube approach now looks like the way forward. Among other things, for IBM and Samsung, it might be a way of solving any near term phase change memory (PCM) scaling problems and provide a cost effective way in which different memory and processor resources can be mixed, as, for all chip types, scaling fab costs rise and the cost of hybrid assembly becomes a reasonable alternative.

Volatile Memory
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re: Micron, Samsung seek hybrid memory spec
Volatile Memory   10/7/2011 3:06:03 PM
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It is not clear to me what Intel, Micron and Samsung are doing. Are they trying to circumvent JEDEC? As far as 3-D solving PCM problems - not in this Universe!

resistion
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re: Micron, Samsung seek hybrid memory spec
resistion   10/7/2011 3:30:11 PM
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Wonder how HMC differs from e-DRAM

resistion
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re: Micron, Samsung seek hybrid memory spec
resistion   1/3/2012 1:41:48 AM
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Scratch that. So does this mean DRAM performance is interconnect-limited?

selinz
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re: Micron, Samsung seek hybrid memory spec
selinz   10/10/2011 6:52:09 PM
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in 1981, IBM was talking about a 6X6X6 cube having a terabyte of memory using bubble memory. Time to pull out some old drawings?

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