SAN FRANCISCO—Sequans Communications SA said Thursday (Oct. 20) it established a technology and marketing collaboration with Fujitsu Semiconductor Ltd. for the purpose of providing customers with a comprehensive LTE product that combines Fujitsu's multimode 2G/3G/LTE RF solution with Sequans’ recently announced next-generation LTE baseband chips.
The Fujitsu RF transceiver supports all major global bands and modes, including LTE bands, and will be pre-integrated and fully validated with Sequans’ LTE chips, Sequans (Paris) said.
The combined solution features Fujitsu's MB86L12A 2G/3G/LTE RF CMOS transceiver and Sequans’ SQN3110 and SQN3120 baseband chips, Sequans said.
The MB86L12A supports all 3GPP LTE-FDD and LTE-TDD bands. The SQN3110 is Sequans’ new 40- nm LTE baseband chip that is 3GPP R9 compliant, supporting category 4 throughput at low power consumption, according to the company. The SQN3120 adds an integrated applications processor for portable hotspots, hostless USB modems and CPE devices, according to Sequans.
The technical collaboration between the companies will focus on ensuring that the combined platform solution is optimized and is fully verified, and that customers can quickly move through the design and prototyping stage into production, Sequans said. Each company will maintain separate responsibility for price, availability and support of its respective products included in the combined platform, the company said.
Reference designs for multiple device types based on the combined Sequans/Fujitsu Semiconductor LTE solution are expected to be available from Sequans beginning later this year, Sequans said.