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ASML, TEL to speed up litho cooperation

11/30/2011 02:43 PM EST
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beinglass
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re: ASML, TEL to speed up litho cooperation
beinglass   12/2/2011 12:44:03 AM
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The industry has a current solution of double patterning that works for a while. There is no reason for a change so EUV is becoming not necessary at this point.Also The industry does not like to change technology very often...so the bottom line EUV might be the tool for 14nm or maybe only at the next generation.

resistion
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re: ASML, TEL to speed up litho cooperation
resistion   12/1/2011 1:18:44 AM
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Even then, it's too late. 3300 can't even do 16 nm.

wilber_xbox
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re: ASML, TEL to speed up litho cooperation
wilber_xbox   11/30/2011 7:33:27 PM
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i think we should conveniently skip 22nm node for EUV and start writing sub-16nm node to introduce EUV.

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