LONDON – Samsung Electronics Co. Ltd., has said it is seeking permission to build a NAND flash memory wafer fab in China and get it running in 2013, according to local reports. The location has not been decided the reports said.
Samsung is expected to spend about $4 billion to bring up a plant to service the Chinese makers of smartphones and tablet computers. The plant would likely begin production with a 20-nm class manufacturing process, the reports said.
Market research firm Gartner Inc. expects the global NAND flash market to grow 20.6 percent in 2011 to reach a size of about $25 billion. It is forecasting 14 percent annual growth in each of 2012 and 2013 to take the market to $28.7 billion and $32.7 billion, respectively.
The wafer fab plan has to be approved by South Korea government. If approved the fab, "will enable us to meet fast growing demand from our customers and at the same time strengthen our overall competitiveness in the memory industry," a Reuters report quoted Jun Dong-Soo, president of Samsung's memory business, as saying.
Samsung is said to be the world's largest supplier of NAND flash memory with about a 40 percent market share.
Samsung recently fired up the world's largest memory fab in Korea. It's Line-16 megafab is expected to eventually produce NAND flash on 200,000 wafers of 300-mm diameter monthly and the phased investment is expected to total approximately 12 trillion won (about $10 billion) to completion. Samsung began mass production of 20-nm-class NAND flash memory at a rate of about 10,000 300-mm wafers per month in September.
David Patterson, known for his pioneering research that led to RAID, clusters and more, is part of a team at UC Berkeley that recently made its RISC-V processor architecture an open source hardware offering. We talk with Patterson and one of his colleagues behind the effort about the opportunities they see, what new kinds of designs they hope to enable and what it means for today’s commercial processor giants such as Intel, ARM and Imagination Technologies.