Design Con 2015
Breaking News
News & Analysis

Sematech identifies top tech challenges to 3-D ICs

12/20/2011 06:53 PM EST
1 Comment
NO RATINGS
More Related Links
View Comments: Newest First | Oldest First | Threaded View
docdivakar
User Rank
CEO
re: Sematech identifies top tech challenges to 3-D ICs
docdivakar   12/28/2011 10:20:06 PM
NO RATINGS
What is discomforting is that the product announcements utilizing stacked 3DIC have all been from big companies like Samsung and Micron. The so called partnerships do not encourage smaller and/or startups to play thru product innovations. This has to change in the 3DIC game, otherwise, it is destined to become the play of a few big companies. MP Divakar

Flash Poll
Like Us on Facebook

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Times on Twitter
EE Times Twitter Feed
Top Comments of the Week