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Sematech identifies top tech challenges to 3-D ICs

12/20/2011 06:53 PM EST
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re: Sematech identifies top tech challenges to 3-D ICs
docdivakar   12/28/2011 10:20:06 PM
What is discomforting is that the product announcements utilizing stacked 3DIC have all been from big companies like Samsung and Micron. The so called partnerships do not encourage smaller and/or startups to play thru product innovations. This has to change in the 3DIC game, otherwise, it is destined to become the play of a few big companies. MP Divakar

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