LONDON – Fabless communications chip company EnVerv Inc. has announced it has raised $12 million in a Series B round of funding led by Benchmark Capital. Previous investors, NEA and Walden International also participated in the round.
EnVerv (San Jose, Calif.) develops chipsets for low- and medium-voltage powerline communication (PLC) for smart grid, monitoring and metering infrastructure. The company has offices in San Diego, California and in China and raised $6 million in its Series A under the name Pervasive in June 2010.
EnVerv is among a number of companies working on highly integrated multi-standard narrowband PLC modems. Standards in this area, many based on orthogonal frequency division multiplex (OFDM), include G3-PLC, PRIME, S-FSK and EnVerv's TurboPLC, the company said. The company has delivered SoCs EnVerv's PLC technology has been field trialed worldwide and has received customer acceptance in all major markets.
The company has delivered SoCs and has been involved in field trails worldwide. The company also claims to have received customer acceptance of its technology in all major markets.
"Mission critical connectivity is the cornerstone of building reliable smart grids worldwide and EnVerv's SoC products provide the best solution for smart grid communications," said Bruce Dunlevie, general partner at Benchmark Capital. "Successful delivery on an array of high performance power line communications SoCs in just over a year is a testament to EnVerv's laser-focused execution and innovative product design."