SAN FRANCISCO—Broadcom Corp. signed a patent license agreement with technology licensor Rambus Inc., Rambus said Thursday (Dec. 22).
The five-year agreement covers the use of Rambus patented innovations in a broad range of chips offered by Broadcom, Rambus said. Financial terms of the deal were not disclosed.
Broadcom and Rambus also settled all outstanding claims, including resolution of part use of Rambus innovations, Rambus said.
"We are pleased to have reached this agreement with Broadcom, a global leader in the semiconductor industry," said Sharon Holt, senior vice president and general manager of the Semiconductor Business group at Rambus, in a statement.