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UMC tips 0.11-micron aluminum BEOL process

12/29/2011 04:56 PM EST
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re: UMC tips 0.11-micron aluminum BEOL process
aarunaku   1/2/2012 12:49:17 AM
Very nice to see that UMC announced this innovation. Had it been 5 years back, this could have been tremendous impact on manufacturing copper interconnect challenges below 0.13um design rules. Glad to see its implications going forward to much larger scale devices.

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