SAN FRANCISCO—Global foundries has commenced initial production at the company's $4.6 billion fab in upstate New York, the company said Monday (Jan. 9).
Globalfounries (Sunnyvale, Calif.) commenced product at the 300-mm fab in Malta, N.Y., by building 32-nm chips for IBM Corp., the company said. The chips are being built based on IBM's silicon-on-insulator (SOI) technology and will be in volume production in the second half of the year, Globalfoundries said.
"Today’s announcement is a natural extension of our longstanding partnership with IBM that includes production of 65-nm and 45-nm chips at our fabs in Singapore and Germany," said Globalfoundries CEO Ajit Manocha, in a statement. "With the addition of our newest factory in New York, we will now be jointly producing chips with IBM at four fabs on three continents."
Globalfoundries’ new Fab 8 campus is located in the Luther Forest Technology Campus about 100 miles north of the IBM campus in East Fishkill, N.Y. It is the largest leading-edge semiconductor foundry facility in the U.S., according to Globalfoundries. When fully ramped, the total clean-room space will be approximately 300,000 square feet and will be capable of a total output of approximately 60,000 wafers per month, Globalfoundries said. The fab will focus on leading-edge manufacturing at 32- and 28-nm and below.
The chips Globalfoundries is manufacturing for IBM feature embedded dynamic random access memory (eDRAM) technology, said to improve on-processor memory performance in about one-third the space with one-fifth the standby power of conventional SRAM, Globalfoundries said.