LONDON – As of July 2011 Taiwan held 21 percent of the world's installed wafer fabrication capacity, surpassing Japan and Korea and taking the top spot for the first time, according to market research firm IC Insights.
Japan held 19.7 percent and Korea 16.8 percent, the Americas region has 14.7 percent of the IC manufacturing capacity and China, with 8.9 percent now accounts for more wafer capacity than Europe.
These figures include local manufacturing capacity regardless of the headquarters location of the companies that own the fabs. So Samsung manufacturing in Austin, Texas contributes to the Americas percentage.
Worldwide semiconductor manufacturing capacity by region as of July 2011 (installed monthly production capacity in 200-mm wafer equivalents x 1,000)
The ROW "region" consists primarily of Singapore, Israel, Malaysia, but also includes countries such as Russia, Belarus, India, South Africa, and Australia.
IC Insights indicated as Taiwan holds 25.4 percent of manufacturing on 300-mm diameter wafers, 18.7 percent of 200-mm wafer capacity, and 11.4 percent of 150-mm wafer capacity. In 2011, 300mm wafers represented 64.6% of the country's installed capacity, 200mm wafers, 29.2%; and 150mm wafers accounted for 6.1%.
Taiwan also holds the industry's largest share of capacity dedicated to "not so leading-edge" 40- to 60-nm process geometries.
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