SANTA CLARA, Calif., EE Times is covering DesignCon in Santa Clara this week, to keep up with the innovations in high speed networking, board design, chips and testing.
The show is where engineers converge to figure out how they're going to make the next fastest thing happen, and thrash out the issues the industry is facing, for example the move from 12 Gbps to 28 Gbps and the dozens of challenges that involves, from signal integrity to power integrity.
Editor Rick Merritt also discusses the attempts to merge multiple test tools in order to make the entire testing process that much less complex.
Check out the video below and join Rick and the rest of the EE Times editorial team for more updates from DesignCon.
For EE Times' full coverage of DesignCon, please visit here.
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