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Wanted: 3-D IC standards within six months

2/1/2012 03:19 AM EST
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GREAT-Terry
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re: Wanted: 3-D IC standards within six months
GREAT-Terry   2/1/2012 3:52:06 AM
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With 3D IC design flow being standardized, will the whole industry be revolutionized?

rick merritt
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re: Wanted: 3-D IC standards within six months
rick merritt   2/1/2012 4:14:26 AM
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I'm thinking this is the future of system design. Anybody else?

chipmonk0
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re: Wanted: 3-D IC standards within six months
chipmonk0   2/1/2012 11:04:00 AM
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Like every other disruptive technology before it, the development and implementation of 3D stacks using TSVs too will follow the path of least resistance and maximum need / profit margin. Thus the next major application for 3D TSVs would most likely be just memory ( DRAM ) at bandwidths greatly increased by 3D stacking so the memory bottleneck in multi - core processors can be eliminated along with the power wasted due to long interconnect lengths. Servers are waiting for just such memory. I would be very surpised if despite all the hoopla & urgency expressed in this report memory / CPU modules using 3D stacks w/ TSVs appear in smartphones anytime soon. Less radical / risky integration schemes can deliver the bandwidth required for real time video. Unless of course fabless market leaders in ARM based processors are scared of getting upstaged by Samsung, which has built 3D memory w/ TSV and can integrate them more easily to their own ARM based processor in their own Fab.

resistion
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re: Wanted: 3-D IC standards within six months
resistion   2/1/2012 4:53:56 PM
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Remember seeing a wafer thinned for TSVs that was essentially semitransparent and very breakable.The silicon sheet resistance definitely goes up as well.

IFTLE
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re: Wanted: 3-D IC standards within six months
IFTLE   2/2/2012 3:07:41 PM
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what about the rumors that TSMC is doing a respin o nthe Apple A6 sothat it can incorporate TSV ? Don't you think this would be an industry driver as well ?

chipmonk0
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re: Wanted: 3-D IC standards within six months
chipmonk0   2/3/2012 7:13:28 PM
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I "feel" that the Apple vs Samsung tangle could turn out to be one of the biggest factors in how 3D TSV implementation and TSMC comes out in the Smartphone segment. There is a "temptation" on the part of Foundries to sidestep yield issues at 28 nm by going back to say 45 nm and partition the SoCs into several layers and then connect them with TSV. Samsung on the other hand I believe is off and running in Austin at 28 nm for A6. Re: connecting Memory to APs by TSVs,the bandwidth needs would not become acute for a couple of years.

docdivakar
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re: Wanted: 3-D IC standards within six months
docdivakar   2/7/2012 5:59:50 PM
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@rick.merritt: assuming your'system' definition refers to a product serving homogeneous or heterogeneous functions while utilizing 2.5D/3D stacking, it will be the future of that system's design. But I would argue that that its function, whether partial or in full, must be complemented by the appropriate value addition in software. That, I believe, is the next generation of 'ASIC' startups! MP Divakar

docdivakar
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re: Wanted: 3-D IC standards within six months
docdivakar   2/7/2012 6:04:41 PM
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@chipmonk: on the contrary, lack of real estate is one of the major drivers for stacking in smartphones. On your last point, Micron is part of the Hybrid Memorycube consortium: http://www.hybridmemorycube.org/ Samsung is also a (founding?) member. MP Divakar

Astier
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re: Wanted: 3-D IC standards within six months
Astier   4/28/2013 9:24:53 AM
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I believe is off and running in Austin at 28 nm for A6. http://www.rctophobby.com/fr/rc-helicopteres/achete-par-marque/walkera.html

Astier
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re: Wanted: 3-D IC standards within six months
Astier   4/28/2013 9:26:23 AM
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I believe is off and running in Austin at 28 nm for A6. http://www.rctophobby.com/fr/rc-helicopteres/achete-par-marque/walkera.html

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