LONDON – IBM, Samsung Electronics Co. Ltd. and Globalfoundries Inc., three companies at the heart of the Common Platform Alliance, will discuss next-generation semiconductor manufacturing process technologies at 2012 Common Platform Technology Forum to be held at the Santa Clara Convention Center on March 14.
Topics on the agenda include 28-, 20- and 14-nm, as well as innovations beyond 14-nm and issues around production of chips using 450-mm diameter wafers. The Common Platform companies include more than 20 additional member companies.
The Common Platform Technology Forum will include keynotes from industry leaders and presentations from senior members of the Common Platform partners’ management and technical teams. A key part of the forum will focus on collaboration for technology delivery, highlighting the rich and broad ecosystem of design enablement and implementation partners through a Partner Pavilion featuring EDA companies, IP, library providers and mask, packaging and design services companies.
"Our focus on building the most extensive and open ecosystem around our core manufacturing capabilities delivers customers a flexible and risk-free way to bring a wide range of semiconductor products to market," said Michael Cadigan, general manager of IBM Microelectronics, on behalf of the Common Platform alliance, in a statement.
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