Embedded Systems Conference
Breaking News
News & Analysis

TSMC, Altera team on 3-D IC test vehicle

3/22/2012 05:00 PM EDT
1 Comment
More Related Links
View Comments: Newest First | Oldest First | Threaded View
User Rank
re: TSMC, Altera team on 3-D IC test vehicle
docdivakar   3/22/2012 7:42:18 PM
Hi Dylan, this appears to be a process improvement of the more general die-to-wafer bonding which is being used by many in 3D IC stacking. Seems like some details are missing here... how does TSMC handle the assembled and subsequently thinned to minimize manufacturing-induced warping? MP Divakar

Flash Poll
Like Us on Facebook

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Times on Twitter
EE Times Twitter Feed
Top Comments of the Week