SAN FRANCISCO—The MEMS packaging market is growing twice as fast as the overall IC packaging market in terms of units shipped and is expected to grow at a compound annual growth rate (CAGR) of about 20 percent over the next five years, according to Yole Développement, a France-based market research firm.
According to a new report by Yole (Lyon, France) the MEMS packaging, assembly, test and calibration market will grow to reach $2.3 billion in value by 2016.
Packaging, assembly, test and calibration steps account for nearly 35 to 60 percent of a total MEMS packaged module's cost, according to Yole. MEMS types of packaging are more complex than most standard IC packages because they require "system-in-package" type of assembly, Yole said. Most MEMS packages are connecting sensors to their final environment, bringing specific constraints at the module level such as building a cavity, a hole in the substrate or metal lead for pressure sensor and microphones, an optical window for optical MEMS, a full vacuum hermeticity at the die level, the firm said.
Yole noted that the application scope of MEMS is broad and diversified. Since its early beginnings, the MEMS industry faced the issue of being a highly fragmented market, with no manufacturing standards clearly emerging, Yole said.
Dylan, I have to take issue with the title -the figure above clearly shows integration of ASIC with MEMS using the IC packaging technology! Even stand alone MEMS packages use existing lines of IC packaging with modifications to equipments and many new ones. So I would rather stretch the definition of a 'system' as in system-on-package and call the integration as SoC packaging!
The test issue is another story. Both probing and final test of MEMS and MEMS-integrated SoC's are very different from their ASIC counterparts.
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