Design Con 2015
Breaking News
News & Analysis

TI says copper wire bonding momentum growing

5/23/2012 11:01 AM EDT
3 comments
NO RATINGS
More Related Links
View Comments: Newest First | Oldest First | Threaded View
wilber_xbox
User Rank
Manager
re: TI says copper wire bonding momentum growing
wilber_xbox   5/26/2012 6:06:46 PM
NO RATINGS
i think that i share the same opinion that what percentage of the copper wire bond went to mission critical chips and high performance chips given the advantages specified in here of Cu over Au.

RockZ
User Rank
Rookie
re: TI says copper wire bonding momentum growing
RockZ   5/24/2012 12:57:15 AM
NO RATINGS
I wonder how many of the 6.5B units made it to aviation/military/automotive applications?

Dave.Dykstra
User Rank
Rookie
re: TI says copper wire bonding momentum growing
Dave.Dykstra   5/23/2012 7:04:00 PM
NO RATINGS
More options to help us move from the use of more precious metals are greatly needed so this one is very welcome. And since it has some apparent cost benefit (just how much is not given in the article), the end result should hopefully be some economic benefit all the way through the chain to the consumer.

Radio
LATEST ARCHIVED BROADCAST
EE Times Senior Technical Editor Martin Rowe will interview EMC engineer Kenneth Wyatt.
Top Comments of the Week
Like Us on Facebook

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Times on Twitter
EE Times Twitter Feed
Flash Poll