SAN FRANCISCO—Chip equipment vendor Applied Materials Inc. announced a physical vapor deposition (PVD) said to enable void-free copper structures at the 1Xnm node.
"Applied has extended its leading PVD technology with a unique system that achieves rapid, void-free fill of these structures at virtually any device node," said Sundar Ramamurthy, vice president and general manager of Applied's Metal Deposition Products business uni, in a statementt. "We're seeing strong customer momentum for the Amber system with more than 30 chambers already in the field. Systems are already qualified as tool of record at leading logic and memory device manufacturers."
Applied (Santa Clara, Calif.) said its Endura Amber PVD system features copper reflow technology that solves critical challenges by using capillary action to draw deposited layers even for the smallest features to fill from the bottom upwards to enable void-free fill from the smallest to the largest features on any die layout.
Pricing and availability information were not provided.
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