LONDON – Eric Meurice, CEO of lithography equipment supplier ASML Holding NV (Veldhoven, The Netherlands), has provided background on the roll out of its next generation extreme ultra violet (EUV) lithography machines and the throughputs customers can expect.
EUV lithography, considered by most of the industry as necessary to allow continued miniaturization of circuits, has been in development for nearly a decade and is still plagued by low power light sources that prevent machines reaching benchmark wafer throughputs in excess of 100 wafers per hour.
Meurice, speaking on a conference call with financial analysts held to discuss the company's somewhat tepid second quarter financial results, provided more EUV information than previously as the company gets close to shipping its NXE:3300 commercial EUV machine. The roll out of the first 11 "process development" machines, capable of handling 300-mm diameter wafers is now expected to be a 2013 event.
While in the short-term ASML is not promising much by way of throughput, possibly as little as 30 wafers per hour by the end of this year Meurice said there is now a roadmap to a throughput of 70 wafers per hour in 2014 and 125 wafers per hour in 2016. As and when customers call for 450-mm capable machines that should provide ASML with about a 10 percent adder on the sales price, Meurice said.
ASML has 11 of the NXE:3300 machines on order but these are now likely to be delivered to customers in 2013, Meurice said. The final integration of the first NXE:3300 at ASML is expected in October or November he added. The NXE:3300 systems shipping in 2013 will only be used for developing manufacturing process technologies, Meurice said but will still result in 800 million euro (about $980 million) of revenue for ASML in 2013.
I do agree that is the other wild card industry is not honest about.
Even if all the technical EUV problems are solved, just as likly at 10nm designers may not be able use use metal system (resistance too high) or transistor electrical characteristics too poor to be usable.
I think it is very clear the economic advantage of scaling is diminishing fast.
In fact we already see that at 20nm today. It is not delievering much cost, performance or power improvement over 28nm.
14/10nm can be made but companies that produce chips at these nodes will likly be no better and perhaps worse off than producing chips at 20/28nm.
Peter, we will see.
I just don't see equipment industry supporting 300mm and 450mm at the same node 10nm? for what 4 customers.
1 customer intel on 450?
3 customers on 300?
2 on each?
There is just too much work getting 2 tool to production level quality (particles, process uniformity etc.). Supporting repairs on both tools, etc.
Market is too small to support this double cost (in my opinion)
I think if 450 happens, at say 10nm ..I bet equipment suppliers like ASML will only develop one type of tool for the 10nm node specs.
I don't see things quite the way you do.
300-mm EUV will last a lot longer than 2 years.
ASML will start on 300-mm for EUV and then as and when Intel wants it they will (supposedly) also supply EUV machines able to process 450-mm wafers.
But they will carry on with 300-mm EUV because not everyone will move over to 450-mm.
Intel will followed by TSMC and Samsung but others could go 450-mm later.
The 2014 to 2016 are low through and not economical. Even it ASML hits 2016 wafer throughput targets (and there is no track record)...
Not much after 2016 450mm is suppose to come in (per same source ASML)
So I don't get the roadmap. 300mm EUV production for 2016-2018 then 450mm.
No way the industry is going to adopt 300mm EUV for just 2 years. No ecomonic benefit (increases cost not lower it).
Please pin these guys down on what exactly is their credible roadmap they are pushing !
except that Intel is already having to think about double-dpouble (quadruple) exposure which ends up being very costly in terms of dwell time on the machine.
But ultimately you may be comparing double exposure EUV that is expensive and quadruple exposure that doesn't work.
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