LONDON – SEMI, the international trade association that represents the interests of semiconductor equipment and materials companies, is planning for a 3-D packaging and through silicon via (TSV) meeting to be held in Grenoble, France, on January 22 and 23, 2013.
TSV is a key enabler of 3-D integration of ICs and is one of the areas of focus for European companies who have thought to avoid the expense of monolithic integration.
The event will include both a conference and an exhibition and will support and showcase the capabilities of leading European semiconductor companies in this area, SEMI said.
Participants are expected to demonstrate a full range of 3-D and R&D process from initial prototypes through to high-volume production.
A steering committee has been set up that includes representative of IMEC, CEA-Leti, Fraunhofer-IZM, Suss Microtec, SPTS, AMS and STMicroelectronics.
Only a company that makes both DRAM and processors has the edge in exploiting TSVs. Samsung could do everything by itself. All other companies must somehow coordinate together, generally awkwardly, to develop standards, avoid pointing fingers, etc.