NEW YORK -- The Nikkei Shimbun, Japan’s economic newspaper, reported that Nikon Corp., the world’s number two stepper manufacturer, is going to work with Intel Corp. to develop the next generation semiconductor manufacturing equipment capable of handling 450-mm wafers.
The report said that Nikon plans to commercialize it by 2018.
How much financial support Intel will provide to Nikon is unclear. The Japanese newspaper reported that Intel “has apparently decided to shoulder tens of billions of yen in development costs for Nikon.”
Chuck Mulloy, a spokesman for Intel, said the company is not commenting on the Nikkei report at this time.
Earlier in July, Intel agreed to acquire a 15 percent stake in ASML Holding NV as part of a $4.1 billion deal to accelerate the development of extreme ultraviolet (EUV) lithography and technology needed for the looming transition to 450-mm wafers.
The $4.1 billion includes about $2.1 billion in equity investment in ASML, good for 10 percent of ASML's shares, Intel said. The company said it also committed to buy another 5 percent of ASML's shares for about $1 billion in the relatively near future.
David Patterson, known for his pioneering research that led to RAID, clusters and more, is part of a team at UC Berkeley that recently made its RISC-V processor architecture an open source hardware offering. We talk with Patterson and one of his colleagues behind the effort about the opportunities they see, what new kinds of designs they hope to enable and what it means for today’s commercial processor giants such as Intel, ARM and Imagination Technologies.