NEW YORK -- The Nikkei Shimbun, Japan’s economic newspaper, reported that Nikon Corp., the world’s number two stepper manufacturer, is going to work with Intel Corp. to develop the next generation semiconductor manufacturing equipment capable of handling 450-mm wafers.
The report said that Nikon plans to commercialize it by 2018.
How much financial support Intel will provide to Nikon is unclear. The Japanese newspaper reported that Intel “has apparently decided to shoulder tens of billions of yen in development costs for Nikon.”
Chuck Mulloy, a spokesman for Intel, said the company is not commenting on the Nikkei report at this time.
Earlier in July, Intel agreed to acquire a 15 percent stake in ASML Holding NV as part of a $4.1 billion deal to accelerate the development of extreme ultraviolet (EUV) lithography and technology needed for the looming transition to 450-mm wafers.
The $4.1 billion includes about $2.1 billion in equity investment in ASML, good for 10 percent of ASML's shares, Intel said. The company said it also committed to buy another 5 percent of ASML's shares for about $1 billion in the relatively near future.
January 2016 Cartoon Caption ContestBob's punishment for missing his deadline was to be tied to his chair tantalizingly close to a disconnected cable, with one hand superglued to his desk and another to his chin, while the pages from his wall calendar were slowly torn away.122 comments