PARIS – LFoundry GmbH (Landshut, Germany) said it plans to invest 25 million euro ($32.8 million) in R&D and innovation projects at its French wafer fab, LFoundry Rousset SAS, over the next three years.
LFoundry said that, following on from success in recent large-scale projects, the investment is intended to support technology enhancement projects in R&D and innovations. It will also allow the company to give its customers access to advanced technologies.
In May, LFoundry announced the availability of its LF110 process development kit for the production of semiconductors in its 110-nm aluminum process with optional 90-nm embedded flash memory and image sensor technologies. Early stage MPW (multi project wafers) are already in production, and the development for a further module release with RF options is under way, the company said.
LFoundry is also a member of the European Union -funded IMPROVE project (Implementing Manufacturing science solutions to increase equiPment pROductiVity and fab performance), which focuses on specific aspects of chip semiconductor production: virtual metrology and predictive maintenance. Project findings have started to be implemented.
Despite the closure of the German wafer fab in Landshut, Germany, in 2011, LFoundry reported a return to profitability during the second quarter of 2012.
The company said LFoundry Rousset had 2Q12 sales revenue of 23.7 million euro (about $28.7 million) and the earnings before interest, tax, depreciation and amortization was 1.5 million euro (about $1.8 million).
Since its formation in June 2009, Lfoundry Rousset has been developing technologies targeted at added value applications such as smartcard, defense and aerospace, automotive and energy management. LFoundry Rousset makes analog and mixed-signal ICs on 200-mm diameter wafers with a manufacturing capacity of about 20,000 wafers starts per month.