ST, Dialog Semi, SanDisk, Elpida, Broadcom
Returning for what is now a sixth appearance in an iPhone are STMicroelectronics paired accelerometers—the L3G4200DH 3-axis digital MEMS gyroscope and the LIS331DLH 3-Axis MEMS accelerometer. Apple feels very comfortable with both of these devices, and one wonders if Nintendo will continue to use these same ICs as well in its next console, the Wii U.
Speaking of familiar manufacturers, Dialog retains its power management IC socket with a new device, the Agatha II, or the D2013. Cirrus Logic also retains its audio codec in the iPhone 5.
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For memory, the 32-GB of NAND flash found in the iPhone 5 torn down by UBM TechInsights was provided by SanDisk. The processor memory is found on a package-on-package (PoP) with the A6 applications processor. The PoP we found in our handset utilized Elpida's B8164B3PM 1-GB pow-power DDR2 (LPDDR2) SDRAM.
Lastly, Broadcom maintains its key design wins in the iPhone 5, with the major win being Broadcom's BCM4334 single-chip dual-band 802.11n, Bluetooth 4.0+HS & FM receiver combo chip providing the wireless connectivity to the handset. This same die was found within the Samsung Galaxy S3, suggesting that this combo chip is the current king of Wi-Fi.
Inside the Murata module containing the Broadcom BCM4334.