IBM said it used ETSOI for two reasons. First, its characteristics
include an ultra-thin body (60 angstroms) that allows aggressive
channel scaling below 30 nm, "and therefore a high level of packing
density obtained," Shahrjerdi said. The second feature is the undoped
channel, which diminishes variability. This allows aggressive
voltage scaling on a chip, he added.
To improve the mechanical flexibility, researchers removed excess
silicon below the buried oxide using an etch process, he added.
A second step to improve flexibility involves transferring the
circuit to a plastic substrate, then removing the "relatively
thick" polyimide tape and nickel layer. The polyimide comes off
because it is attached with a thermal release adhesive; the nickel
is removed by means of a chemical etch, he noted.
IBM reported slight degradation of the delay characteristics for the
flexible sample compared to its measured delay characteristics
before the layer transfer, an more so on pFETs (a degradation in
performance of 30-40 percent) than nFETs.
To determine the source of degradation, IBM controlled spalling
on another ETSOI wafer using the same processing steps. This time
it was bonded rigidly to a silicon wafer instead of being mounting on a
plastic substrate. IBM concluded that the pFET performance
degradation was caused by probe rather than stress induced by the
Shahrjerdi claimed 97 percent yield in the lab, and any problems
they encountered were related to the nickel-sputtering tool, which
affected that layer.
He also claimed the process is reproduceable, "By knowing he
stressor level in the nickle layer, it gives you the depth for the
spalling," Shahrjerdi said. Variability was plus or minus 1
While it is innovative and new, it is quite expensive. The more popular and used it will be, the more pocket friendly it will be.
I think for sale they will be available only somewhere in late 2015.
William - http://www.carid.com/
IBM is again way ahead. But pocket cellphones, commercially? How are you going to hold these phones. Need Blue Tooth at all times. Then what happens if you need to check or take pictures. Oh of course, they will sell you a flat board to use on it. Medical usage, yes. Some audio, video units, environmental temp detections etc, yes.
Thanks for sharing us this fantastic post, I highly recommend that this should be read by others too.. I really appreciate this low-cost technique for manufacturing silicon-based electronics, as it looks to be very innovative and more pocket friendly.
John Marry- http://www.wheelfire.com/
David Patterson, known for his pioneering research that led to RAID, clusters and more, is part of a team at UC Berkeley that recently made its RISC-V processor architecture an open source hardware offering. We talk with Patterson and one of his colleagues behind the effort about the opportunities they see, what new kinds of designs they hope to enable and what it means for today’s commercial processor giants such as Intel, ARM and Imagination Technologies.