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Cisco packs silicon photonics on 3-D ICs

1/29/2013 02:10 AM EST
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docdivakar
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re: Cisco packs silicon photonics on 3-D ICs
docdivakar   1/29/2013 7:27:17 PM
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Rick, the title is somewhat misleading... I think Mr. Swift was referring to planar Si optical waveguides. Using these in 3D optical interconnect, from today's on-chip optical interconnect technology, is still far away from fruition from a practical view point. Last year's DesignCon I think there was a talk by HP Lab's chief about this but it has remained largely as a research project. There is no doubt that this is the next growth area for transistors. Underwhelming SDN/OpenFlow by Cisco is not surprising because it is a disruptor to their legacy products! For those interested, here is the link to presentations from Silicon Valley Comsoc on SDN's by Guru Parulkar & Dan Pitt of Open Networking Research Center: http://ewh.ieee.org/r6/scv/comsoc/ComSoc_2012_Presentations.php MP Divakar

a.sun
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re: Cisco packs silicon photonics on 3-D ICs
a.sun   1/29/2013 7:25:23 PM
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The laser is made of InP by bonding a 2-4" InP wafer onto a 6-8" Si wafer (the size mismatch is an issue!) and thinning down the InP wafer to a few micrometers for later planar processing steps. As far as I know, Intel's solution uses separate CMOS TIA & laser driver chips in addition to a Si photonics chip (including functions of photo detection, modulation and optical routing) in comparison to a more integrated solution from Luxtera.

a.sun
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re: Cisco packs silicon photonics on 3-D ICs
a.sun   1/29/2013 7:24:35 PM
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The laser is made of InP by bonding a 2-4" InP wafer onto a 6-8" Si wafer (the size mismatch is an issue!) and thinning down the InP wafer to a few micrometers for later planar processing steps. As far as I know, Intel's solution uses separate CMOS TIA & laser driver chips in addition to a Si photonics chip (including functions of photo detection, modulation and optical routing) in comparison to a more integrated solution from Luxtera.

HS_SemiPro
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re: Cisco packs silicon photonics on 3-D ICs
HS_SemiPro   1/29/2013 6:37:11 AM
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That's the beauty of 2.5D and full 3D designs, greatly reduce system cost improve signal latency

rick merritt
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re: Cisco packs silicon photonics on 3-D ICs
rick merritt   1/29/2013 6:07:37 AM
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But not as much resistance as an off-chip design ;-)

resistion
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re: Cisco packs silicon photonics on 3-D ICs
resistion   1/29/2013 4:13:20 AM
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The lasers are still non-Si; they are probably InP or the like at the very least. So it looks like interposers will replace motherboards? That's pretty disruptive. Expect some resistance.

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