SAN FRANCISCO—Chip packaging IP licensor Tessera Technologies Inc. said Thursday (Feb. 28) it reached a settlement agreement with Advanced Micro Devices Inc. (AMD) settling all pending litigation between the two companies.
Financial terms of the settlement were not disclosed. Tessera said both companies agreed to dismiss claims and counterclaims relating to Tessera's patent infringement claims pending in U.S. District Court in Northern California.
Tessera (San Jose, Calif.) declined to provide additional financial guidance in connection with the agreement. Related stories:
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