PORTLAND, Ore. — Georgia Institute of Technology has received a three-year $2.9 million contract, with industry partner Rockwell-Collins, to develop liquid evaporation cooling techniques for three-dimensional chip stacks from the Defense Advanced Research Projects Agency (DARPA) as part of its Intrachip/Interchip Enhanced Cooling (ICECool) program in DARPA's Microsystems Technology Office.
Researchers from Georgia Technology will develop liquid cooling techniques using micro-sized microfluidic channels that cool chips 10-times better than today's techniques, with particular attention paid to cooling chip hot-spots, such as arithmetic-logic units.
The researchers are already developing "schemes that can address high power on the whole chip coupled with very high-power dissipation areas that are only a few millimeters square," said professor Yogendra Joshi, the project's principal investigator. Also participating in the project are professors Muhannad Bakir, Andrei Fedorov and Suresh Sitaraman.
Georgia Tech researchers Muhannad Bakir, Andrei Fedorov, Yogendra Joshi and Suresh Sitaraman are developing three-dimensional chip cooling technology that will be able to handle heat loads as much as ten times greater than systems commonly used today. (Georgia Tech Photo: Gary Meek)
SOURCE: Georgia Tech
Detail from above photo. (Georgia Tech Photo: Gary Meek)
SOURCE: Georgia Tech
The non-uniform cooling system will use special liquid-evaporation techniques that can dissipate one kilowatt per square centimeter over an entire integrated circuit and handle five kilowatts per square centimeter on millimeter-sized hot spots. The researchers will also characterize different coolants as well as develop detailed models for how liquids boil at the micron scale.
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