Europe's vision for automotive electronic control units is that by 2020 the vehicle battery will supply microcontrollers using an on-chip power-management architecture called PowerSoC -- for power supply on chip. To fulfill that vision, it has been deemed necessary to miniaturize and integrate trench capacitor substrates and thin-film magnetic on silicon to enable an LCR-capable power supply on an interposer that can be combined with microcontrollers.
The Tyndall National Institute in Cork, Ireland, is working with Infineon Technologies (Munich Germany), Robert Bosch (Reutlingen, Germany) and Ipdia (Caen, France) in the Powerswipe project to do that. To achieve the miniaturization of the power passives requires that the switching frequency is increased to between 20-MHz and 100-MHz. The three-year PowerSwipe project, with a budget of 5 million euro (about $6.5 million), is part funded by the European Union.
Click on image to enlarge.
Micro-inductors and transformers on a four-inch diameter silicon wafer made by the Tyndall National Institute.
Probaly 1st used for power gating and not for logic, low level logic that does not need speed.
If contact resisitanc eis made low enough these could be put in series to provide better MTBF for the case of stuck switch on.
Low frequency logic will also be applicable for this.
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