MANHASSET, NY -- The pace of development in silicon integration of microelectromechanical systems and sensors is growing exponentially as seen from technical presentations at the upcoming 2011 International Solid State Circuits Conference.
3-D sensing used in accelerometers and gyroscopes enable novel gesture-based user interfaces and games. ST Microelectronics will discuss a gyroscope that enables 3-D rotation sensing with a single chip. The 3-axis gyro combines 3 tuning forks in a single vibrating element sensed by a multiplexed digital readout.
Mobile power sources needed for mobile sensors tap scavenged environmental energy. The University of Idaho and the University of Michigan will reveal systems at ISSCC that are able to extract energy from ambient light or vibration.
Delft University of Technology researchers will detail a low-power thermal wind speed and direction sensor that dissipates 50 mW, nine times less than a previous CMOS design and less than that of MEMS-based wind sensors.
U. of Freiburg researchers will present a telemetric stress sensor for orthodontic brackets. The CMOS stress-mapping system with 24 sensors is sensitive to in-plane shear stress or differences of normal stresses. The telemetrically-powered system consists of a chip and microcoil communicating at 13.56MHz. Its dimensions permit the development of smart brackets for a direct force feedback in orthodontic treatments.
The limited amount of power available to autonomous sensors forces energy-scavenging circuitry to boost low voltages up to levels that are needed to drive the rest of the electronics. The imec-Holst Center will describe a chip that efficiently harnesses solar energy to charge a battery using an innovative solar cell integrated within an imager’s pixel circuitry.
Canon’s new image sensor will be described. It has 1.6Mpixels and occupies an entire 12-in CMOS wafer. The huge pixel size, combined with a built-in 0 to 24dB programmable gain, enables an ultra-high light sensitivity of 25 Melectrons/lux/sec and operates at 100 frames/s with global synchronous shutter.
In the emerging technologies arena advances in designing in energy harvesting, smart power grid, silicon photonics, terahertz imaging and power management will be featured.
Printable organic devices on flexible films have great potential to realize low-cost power meters. University of Tokyo researchers will detail a low-cost 100V AC power meter based on a system-on-a-film (SoF) concept.