MANHASSET, NY -- As 3-D integration and packaging approaches an inflection point, an upcoming conference in this area will bring together semiconductor luminaries for discussing 3-D commercial opportunities.
The RTI conference on 3-D Architectures for Semiconductor Integration and Packaging will shed light on companies who seek to secure a technology position, and obtain new process and design tools.
The conference is under the aegis of research firm RTI International and its
Center for Technology Applications which provides services to extract the maximum value from intellectual property.
One speaker is Paul Enquist, Ziptronix Inc.’s chief technology officer and vice president of R&D, who will provide an update on direct bond technology for 3-D ICs.
His presentation, “Applications Driving Adoption of Low Temperature Direct Bond Technology for 3-D Integrated Circuits,” will include:
• Low temperature direct bond technology with and without 3-D interconnect
• Scaling advantages of low-temperature direct bond technology
• Implementation of low-temperature direct bond technology
• Early adopter applications
• Volume manufacturing adoption
Ziptronix is a pioneer in the development of low-temperature direct bond technology for a variety of semiconductor applications, including backside-illuminated (BSI) sensors, RF front-ends, pico projectors, memories and 3D integrated circuits.
Also speaking at the conference, among others, are: Ivo Bolsens, Xilinx senior vice president and chief technology officer responsible for advanced technology development Xilinx research laboratories and Xilinx university program; Michael Jackson, Synopsys Vice President of Engineering; Joe Sawicki, Vice President and General Manager, Design-to-Silicon Division at Mentor Graphics; Lisa Jensen, Solutions Director at Cadence Design Systems; Douglas C-H Yu, TSMC Senior Director, Integrated Interconnect and Package Division, R&D; Bradley Howe, Altera Vice President, IC Engineering; Daniel Berger, Manager, IBM 3-Di Technology Development; Eric Beyne, IMEC Scientific Director Advanced Packaging and Interconnection; Sitaram Arkalgud, Director, Interconnect at Sematech; Jonathan Candelaria, Director, Interconnect & Packaging at Semiconductor Research Corp.,Jim Feldhan, President, Semico Research, Sesh Ramaswami, Senior Director, Strategy at Applied Materials Silicon Systems Group.
The conference will be on Dec. 12-14 at the Hyatt Regency San Francisco Airport Hotel in Burlingame.