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Red Micro Wire encapsulates wire bonding in glass

3/26/2012 02:36 PM EDT
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Kinnar
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re: Red Micro Wire encapsulates wire bonding in glass
Kinnar   3/26/2012 7:48:52 PM
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Very great achievement by Red Microwire as packaging and pin-outs are always the limiting factors of the semiconductors, this reduction in the dimensions will not only improve the today packages but that will help developing the future miniature packages.

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