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Graphene composite beats copper for cooling chip

4/11/2012 02:04 AM EDT
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krisi
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re: Graphene composite beats copper for cooling chip
krisi   4/19/2012 4:16:49 PM
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I guess there is a graphite and there is a graphite...the link you quote @Rwatkins contains the following bullet point: Our graphite is GREATER THAN 4 X COPPER AND NATURAL GRAPHITE...so one graphite is 4 times better than another graphite, this is for those who are not yet confused yet ;-)...Kris

RWatkins
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re: Graphene composite beats copper for cooling chip
RWatkins   4/19/2012 4:12:41 PM
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Now I am a little baffled. A look at http://www.minteq.com/our-products/minteq-pyrogenics-group/pyroid-ht-pyrolytic-graphite/ finds a graphite product claiming 4X improvement over copper (although fine print reading shows that 4X is only in one plane and the perpendicular to that plane is "only" near copper).

RWatkins
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re: Graphene composite beats copper for cooling chip
RWatkins   4/19/2012 4:07:18 PM
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For a bit of an education, for those unfamiliar with issues such new technology can take, we should all remember the time it has taken to commercialize FETs from SiC (discussions and work started in the mid 1970's, first commercial devices only a couple of years ago). The challenges are similar, a problematic chemistry that depends heavily on processing means and can very immensely due to what seem like obtuse causes.

krisi
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re: Graphene composite beats copper for cooling chip
krisi   4/13/2012 9:06:52 PM
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It would be much efficient to remove heat using water micro-pipes...that 25% advantage that Colin is quoting in the article is pretty small...generally a new technology requires at least 2x improvements upon the existing one...Kris

R_Colin_Johnson
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re: Graphene composite beats copper for cooling chip
R_Colin_Johnson   4/13/2012 7:51:43 PM
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Yes, graphene should help with heat, power consumption, cost, speed and weight. There are still many engineering hurtles to clear, and lots of room for innovation, but that's where the fun is-isn't it?

Robotics Developer
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re: Graphene composite beats copper for cooling chip
Robotics Developer   4/13/2012 7:28:37 PM
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As a one time ASIC designer, I welcome the improved heat dissipation using graphene. I remember having a major battle with heat and power on the devices. The end result was clock gating, parallel paths with slower clocks, in general a pain. If only we could get power into the core and get the heat out using graphene, time will tell..

R_Colin_Johnson
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re: Graphene composite beats copper for cooling chip
R_Colin_Johnson   4/13/2012 7:26:34 PM
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I eventually envision different formulations of grapheme replacing the metal, semiconductors and insulators in mobile devices, the most amazing benefit of which will be ultra-light weight. Ever notice how heavy your smartphone is compared to a styrofoam block that same size? The weight is mostly from all the copper on circuit boards and for the interconnect inside the chips. With those alone replace with grapheme, you smartphone could become almost as light as that block of styrofoam!

Sanjib.A
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re: Graphene composite beats copper for cooling chip
Sanjib.A   4/13/2012 6:47:14 PM
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This application of graphene is really cool :-) ...really amazing to see so many good application of graphene...what else could by done by graphene?

R_Colin_Johnson
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re: Graphene composite beats copper for cooling chip
R_Colin_Johnson   4/11/2012 9:07:12 PM
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Regarding controlling the band gap, RPI team report tuning the bandgap of graphene anywhere from 0 (a pure metallic conductor) all the way to .2 eV (a semiconductor suitable for infrared detectors) by simply controlling the amount of humidity inside the package: http://www.eetimes.com/electronics-news/4210253/Graphene-bandgap-opened-by-vapor Rice University reports turning grapheme into an insulator by bonding it to a monolayer of hydrogen: http://www.eetimes.com/electronics-news/4199595/Researchers-cast-graphene-into-quantum-dots

Daniel Payne
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re: Graphene composite beats copper for cooling chip
Daniel Payne   4/11/2012 7:35:46 PM
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Kris, Thanks for the practical reality check. Daniel

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