MANHASSET, N.Y. -- DRAM and flash memory chip provider SK Hynix has joined the Sematech consortium's EMI partnership to develop metrology tools used to spot defects in advanced masks needed for extreme ultraviolet lithography.
Sematech launched the EMI (EUVL Mask Infrastructure) partnership in 2010 to tackle infrastructure gaps for EUV lithography in mask metrology. It will fund the development of new metrology tools.
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In joining the group, Sungjoo Hong, head of SK Hynix's R&D division, said, "We expect to play a key role in accelerating the commercialization of EUV technology by supporting the development of critical metrology tools to enable defect free masks."
Stefan Wurm, Sematech's director of lithography, said the roll out of EUV lithography will be hastened by the development of new tools for spotting mask defects.
Sematech and equipment maker Carl Zeiss are collaborating to develop a new tool called an actinic aerial image metrology EUV system that is expected to be deployed when the advanced lithography technique reaches volume production, Sematech said.
The tool will support 16-nm half-pitch technology node requirements and beyond. It is expected to be ready for production in mid-2014.
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