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China Fabless: Rockchip rattled by Android tablet wars

9/25/2012 04:01 PM EDT
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GREAT-Terry
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re: China Fabless: Rockchip rattled by Android tablet wars
GREAT-Terry   9/26/2012 12:16:33 AM
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It is amazing to finish a chip design in just 2 months (started a chip in March, showed it in trade show in April and then shipped the samples in May). How much faster can they shorten the design cycle? I have no idea how innovation can take place if there is just little time for chip design to sit down to work, not even think. Personally, I don't think this can help the company to grow healthily and such strategy can't last long.

joepaiii
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re: China Fabless: Rockchip rattled by Android tablet wars
joepaiii   9/26/2012 3:50:36 AM
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I am a little doubtful about that timeline, you can't even make it through the fab in 30 days using an advanced node.

casual3
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re: China Fabless: Rockchip rattled by Android tablet wars
casual3   9/26/2012 7:10:25 AM
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Rockchip outsources most of the design work to GUC which is a TSMC affliate. My sources told me it usually takes 3 iterations (sometimes 4) to get it right. So the March to May time frame could be the 3rd try, which could be a simple metal change, or from MPW shuttle to full-mask.

gatorfan
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re: China Fabless: Rockchip rattled by Android tablet wars
gatorfan   9/26/2012 3:57:38 PM
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Wow, a single iteration at 28nm is expensive....3-4 of those blows my mind how these guys can be competitive at all in either cycle time or cost.

sranje
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re: China Fabless: Rockchip rattled by Android tablet wars
sranje   9/26/2012 11:28:56 PM
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Dear Junko, Another very informative article - many thanks. I do have an interesting question - since you are quoting Rockchip's CEO: The RK31xx is a dual core Cortex A9 product designed for tablets and smartphones. Using Globalfoundries' high-k 28-nm process, “we can reduce cost, gain performance, but most importantly, we will reduce power consumption for tablets,” said Chen Will the package interconnect for this application processor be Cu-wire wirebond or flip-chip bumps? I am curious how much wirebond for multi-core application processors even in 28nm. Many thanks in advance if you can find and provide the answer.

junko.yoshida
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re: China Fabless: Rockchip rattled by Android tablet wars
junko.yoshida   9/27/2012 10:44:23 AM
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I think I am the guilty one here, not articulating this whole "design" process well in the story. I will correct the story accordingly. Meanwhile, here's an e-mail I just received from Rockchip's Chen. He clarified this for us as follows: "What I meant was, after we got the chip, we were able to get the chip in end products in less than 2 months."

junko.yoshida
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re: China Fabless: Rockchip rattled by Android tablet wars
junko.yoshida   9/27/2012 10:54:40 AM
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Hi, sranje. Rockchip's VP Chen just got back to me on your question. Here's what he wrote in his e-mail: "It’s not flipchip, still cu-wire bond, we are planning flipchip though."

Hiramalik
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re: China Fabless: Rockchip rattled by Android tablet wars
Hiramalik   9/27/2012 11:57:24 AM
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That's really awesome post and love to find more update about Android. For Job Opportunities in Pakistan visit http://hiring.rozee.pk/

sranje
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re: China Fabless: Rockchip rattled by Android tablet wars
sranje   9/27/2012 2:18:49 PM
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Dear Junko - thank you very much for publishing Rockchip CEO's reply to my question on the new 2-core A-9 application processor in 28nm. So it will be in wirebond. But with plans for flip-chip also.

junko.yoshida
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re: China Fabless: Rockchip rattled by Android tablet wars
junko.yoshida   9/27/2012 2:53:33 PM
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You're quite welcome. I am glad you asked the question and Rockchip's Chen came back to us with an answer!

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