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Case studies highlight temperature solutions for 3-D ICs

2/15/2013 04:39 PM EST
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DrQuine
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re: Case studies highlight temperature solutions for 3-D ICs
DrQuine   2/18/2013 2:44:42 AM
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Are 3D IC packages an opportunity for localized liquid cooling? If a nonconductive fluid ran through the layers and communicated with a metal heat sink, the heat could be dissipated.

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