LONDON – Chip research consortium Sematech has announced that six semiconductor companies have joined its 3-D enablement program based at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany.
The six companies are: Advanced Semiconductor Engineering Inc. (ASE), Altera Corp. Analog Devices Inc. (ADI), LSI Corp. and On Semiconductor Corp. and Qualcomm Inc. They join Globalfoundries, Hewlett Packard, Hynix, IBM, Intel, Samsung, and UMC in a broad initiative preparing for through-silicon via (TSV) enabled 3-D stacked components.
Notable absentees from the list are the world's leading foundry Taiwan Semiconductor manufacturing Co. Ltd. and Toshiba.
The member companies are working together to help define EDA software tools and appropriate test vehicles for 3-D integration.
"Research on 3-D technologies has been ongoing for many years, and the initiative that Sematech has spearheaded is working to find solutions to the challenges faced by lack of standardization. We're pleased to see this partnership expand and grow," said Dan Armbrust, president and CEO of Sematech, in a statement.
Sematech, along with the Semiconductor Industry Association (SIA) and the Semiconductor Research Corporation (SRC), launched the program in December 2010. The primary focus is on developing technologies and specifications necessary for establishing standards in critical areas such as inspection, metrology, microbumping, bonding and thin wafer, and die handling.
Membership is open to international fabless, fab-lite and IDM companies, semiconductor assembly and test (OSAT) suppliers, and EDA process tool and materials suppliers. The program and its members are also collaborating with companies, consortia, universities, national laboratories, and associations from around the world.
Related links and articles:
Sematech partners with RRAM startup
3-D ICs stack up design challenges
‘Mid-end’ foundries alter advanced packaging landscape