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Six more firms join Sematech's 3-D team

4/25/2011 03:08 PM EDT
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re: Six more firms join Sematech's 3-D team
deans_#1   4/25/2011 9:06:56 PM
I wonder why TSMC doesn't want to get involved. Could they be doing something on their own, or perhaps, they simply don't support the effort to standardize. In any event, it's good to see the momentum building for 3D, now we just need to keep going on to monolithic 3d - www.monolithic3d.com!

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re: Six more firms join Sematech's 3-D team
docdivakar   4/25/2011 9:05:02 PM
@Peter Clarke: TSMC may not have formally joined Sematech's 3D chip initiatives but they are working on several 3D TSV projects from what I hear. The 3D EcoSystem is beginning to take shape -there is EDA, Soft/Hard IP, OS and App S/W Drivers, Foundry, OSAT and product owners. The interaction between the ecosystem partners and ownership is still loosely defined and varies if one is using 2.5D approach or a full 3D (TSV-enabled) approach. There are several organizations involved in the "standardization" efforts besides Sematech -GSA, Si2, Jedec, Semi.org, etc. How ever, the much needed "standard" in interoperability of EDA tools to enable and realize 3D stacked designs is still lacking. I hope you will cover that in a future article! Dr. MP Divakar

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