Breaking News
Research

Six more firms join Sematech's 3-D team

4/25/2011 03:08 PM EDT
2 comments
NO RATINGS
More Related Links
View Comments: Newest First | Oldest First | Threaded View
deans_#1
User Rank
Rookie
re: Six more firms join Sematech's 3-D team
deans_#1   4/25/2011 9:06:56 PM
NO RATINGS
I wonder why TSMC doesn't want to get involved. Could they be doing something on their own, or perhaps, they simply don't support the effort to standardize. In any event, it's good to see the momentum building for 3D, now we just need to keep going on to monolithic 3d - www.monolithic3d.com!

docdivakar
User Rank
Manager
re: Six more firms join Sematech's 3-D team
docdivakar   4/25/2011 9:05:02 PM
NO RATINGS
@Peter Clarke: TSMC may not have formally joined Sematech's 3D chip initiatives but they are working on several 3D TSV projects from what I hear. The 3D EcoSystem is beginning to take shape -there is EDA, Soft/Hard IP, OS and App S/W Drivers, Foundry, OSAT and product owners. The interaction between the ecosystem partners and ownership is still loosely defined and varies if one is using 2.5D approach or a full 3D (TSV-enabled) approach. There are several organizations involved in the "standardization" efforts besides Sematech -GSA, Si2, Jedec, Semi.org, etc. How ever, the much needed "standard" in interoperability of EDA tools to enable and realize 3D stacked designs is still lacking. I hope you will cover that in a future article! Dr. MP Divakar

Flash Poll
Radio
LATEST ARCHIVED BROADCAST
EE Times editor Junko Yoshida grills two executives --Rick Walker, senior product marketing manager for IoT and home automation for CSR, and Jim Reich, CTO and co-founder at Palatehome.
Like Us on Facebook

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Times on Twitter
EE Times Twitter Feed
Top Comments of the Week