Actel Corp. said its 0.22-micron antifuse FPGA technology is now being qualified for production at United Microelectronics Corp. (UMC), Hsinchu, Taiwan. Samples are expected in March, with volume production by the second quarter.
The new technology offers a 20% reduction in die size and a 10% improvement in performance over Actel's current 0.25-micron antifuse devices, according to the Sunnyvale, Calif., company.
Historically, Actel's antifuse technology has been manufactured on trailing edge processes, which had the effect of masking its architectural advantages, the company claims. The aggressive ramp of UMC's 0.22-micron process has placed Actel on a level playing field with other leading programmable logic suppliers, said Carl Burrow, vice president of marketing at Actel.
"We are to the point where our antifuse FPGA processes are now at parity with mainstream FPGA processes," Burrow said. "And because the cost, performance and power-dissipation advantages inherent in the antifuse architecture are clearly evident, Actel's new families are winning designs solely on their merits against competitive alternatives."
Actel also appears to be on an accelerated development cycle for its next-generation of antifuse products, which will be manufactured using 0.15-micron transistor geometries.