The U.S. International Trade Commission Thursday agreed to investigate a complaint by Tessera Inc. that Texas Instruments Inc. and Sharp Electronics Corp. have violated patents protecting micro-BGA chip-scale semiconductor packaging technology.
As common in ITC cases, Tessera, San Jose, is asking that chips made by TI and Sharp that use the alleged micro-BGA packages be barred from import into the United States.
Tessera alleged in the complaint that negotiations with the two chip makers over licensing a version of the company's micro-BGA technology had broken down. The packaging design house has also filed separate patent infringement suits against TI and Sharp in federal district courts in Los Angeles and San Jose.
The ITC will appoint an administrative law judge to process the Tessera complaint and make a preliminary determination in about a year. Depending on the outcome, the full ITC commission would then make a final ruling.