Analog Devices Inc. and Intel Corp. said today they will provide the first details of their joint DSP development effort on December 5.
Intel and ADI first announced their intent to co-develop a new DSP architecture in February 1999, and have since provide virtually no details of the project, code-named Frio.
The new core is expected to be low power and high performance, and targeted at embedded communications and computing applications such as Internet-enabled cellular handsets.
Earlier this year, Ron Smith, vice president of Intel's Wireless Communications & Computing Group, said Frio would likely provide the DSP functionality for its Intel Personal Client Architecture (IPCA) platform, which is built around its previously disclosed XScale microprocessor. It is expected to be pitted against Texas Instruments Inc.'s Open Multimedia Applications Platform, which is built around TI's TMS320C55x DSP and the ARM9 microprocessor.
The Frio would be the second jointly developed general-purpose DSP architecture. Lucent Technologies Microelectronics Group and Motorola Inc.'s Semiconductor Products Group co-developed the StarCore architecture, which is now shipping in volume.
In addition to Smith, ADI's chief executive, Jerry Fishman, is scheduled to participate in the Dec. 5 press conference, which will be held at the Millennium Broadway Hotel conference center.