Sony Corp. and Toshiba Corp. on Monday separately announced plans to build 300mm-wafer fabs with 65nm processing.
The Sony Computer Entertainment Inc. group will invest about $1.7 billion (200 billion yen) over the next three years to build its 300mm fab in Isahaya City, Japan, to make its next-generation electronic game processor, code-named Cell. Sony has been working on joint development of the Cell technology with IBM Corp. and Toshiba since 2001.
The fab would also produce other system-on-a-chip (SoC) devices for future Sony electronic game consoles.
Sony didn't project when the new 300mm fab would enter mass production. This fiscal year, Sony said $613 million would be spent on initial construction of the new fab.
"Execution will be determined by taking optimal timing, place and allocation into consideration," the company said.
Separately, Toshiba said it would invest $1.7 billion over four years to build a 300mm fab in Oita, Japan. This would be Toshiba's second 300mm fab, as the company has already announced it would install a 300mm fab line in Yokkaichi, Japan, to make advanced memory products.
Initially, the Oita fab would have 65nm process capability, later transitioning to 45nm processing. First production is expected in mid-2004.
The Toshiba fab will make SoC microprocessors, mainly for broadband network applications, the company said. Toshiba and Sony are also planning to use the new fab in a joint project with Sony Computer Entertainment to make some SoCs for Sony's next game console.
Toshiba said details of the joint arrangement with Sony will be disclosed in the future.