Dallas, Texas — Texas Instruments has introduced an ADC that combines 12 bits of resolution with a 1-GSPS sampling rate, effectively doubling the amount of signal bandwidth that can be captured in a single ADC. The ADS5400 offers a signal-to-noise ratio (SNR) of 59 dBFS and 75 dBc spurious-free dynamic range (SFDR) in first Nyquist, and 58 dBFS SNR and 70 dBc SFDR performance for intermediate frequencies (IFs) beyond 1000 MHz.
A fully buffered analog input isolates the onboard sample and hold's internal switching to prevent disturbing the signal source, while providing a high-impedance input. The ADC's performance enables designers to create smaller, higher-performance and higher-density wide-bandwidth receivers and digitizers.
According to Art George, senior vice president of TI's High-Performance Analog business unit, customers can use the ADS5400's combination of resolution, sample rate and bandwidth to significantly enhance applications in defense by improving radar and signal intelligence (SIGINT) capabilities, and can double the capture bandwidth of signals with 12-bit resolution in test and measurement.
Developed on TI's high-speed, proprietary BiCom3 complementary bipolar SiGe technology, the monolithic ADS5400 is specified over the full industrial temperature range (-40 to 85 degrees Celsius). The BiCom3 technology's silicon-on-insulator (SOI) process makes it well suited for high-temperature and high-radiation environments.
Key features and benefits include:
— Fully buffered, 12-bit, 1-GSPS ADC with 2.1 GHz input bandwidth, for wideband signals in oversampling and undersampling applications with 200 MHz or greater signal bandwidth,
— Buffered analog input to deliver constant input impedance across time and frequency and to eliminate sample-and-hold kickback, simplifying input matching for passive and active analog front end,
— An adjustable fine gain, offset and phase to ease the interleaving of two or more ADCs to create a multi-GSPS digitizer, or the balancing of two ADCs in an I/Q receiver,
— Thermally-enhanced, 100-pin TQFP (16 mm x 16 mm footprint) package with exposed thermal pad, and
— User-selectable single- or dual-bus DDR LVDS outputs to provide designers flexibility to choose between I/O speed and pin-count.
Further customers can speed time-to-market with compatible TI devices: THS9000 and THS9001 amplifiers to support input frequencies up to 500 MHz; the CDCE72010 high-performance, low phase noise, and low skew clock; the DAC5682Z dual, 16-bit, 1 GSPS DAC; the TPS727xx and TPS717xx low dropout regulators; and the TMS320C6474 and TMS320C6457 DSPs.
For further information visit www.ti.com.