Molex Incorporated has introduced the latest addition to its Impact backplane connector family of products, Impact 85 Ohm, to meet the growing demands of next generation server, storage and data networking equipment.Molex’s new Impact 85 Ohm connector system is designed to support the Intel®Quick Path Interconnect (QPI)standard, PCI Express Generation 2.0 and 3.0, as well as any proprietary system design where 85 Ohm differential impedance is desired.
To allow designers the flexibility of interchanging 100 Ohm and 85 Ohm signal modules based on system needs, Molex designed both connector systems to be of the same physical size, density, pitch and PCB layout, as well as using the same guidance and power solutions. Therefore, to avoid confusion between the Impact 85 Ohm and the 100 Ohm lines, Impact 85 Ohm is offered in a light grey LCP so that designers can visually “colour code” their designs.
Impact 85 Ohm also uses the existing Impact 100 Ohm connector compliant pin and mating interface designs, saving designers the time and cost to re-qualify the critical-to-function portions of the connector system. These proven designs offer superior electrical and mechanical performance compared to other backplane connectors on the market today.
Molex continues to expand its Impact backplane connector family. It is now tooled and available in 2-, 3-, 4-, 5-, and 6- pair traditional backplane header and daughtercard connector versions that support differential signal densities ranging from 27 up to 80 pairs per linear inch, with a complete range of guidance, power, coplanar, mezzanine and high performance cable solutions.
Molex Incorporated (NASDAQ: MOLX AND MOLXA)is a 70-year-old global manufacturer of electronic, electrical and fibre optic interconnection systems. Based in Lisle, Illinois, USA, the company operates 45 manufacturing locations in 17 countries. The Molex website is: www.molex.com
Note: The above text is the public part of the press release obtained from the manufacturer (with minor modifications). EETimes Europe cannot be held responsible for the claims and statements made by the manufacturer. The text is intended as a supplement to the new product presentations in EETimes Europe magazine.
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