Toshiba has announced the launch of a CMOS image sensor that will bring 14.6 million pixels to digital still cameras and to mobile phones supporting video imaging. The sensor, the latest addition to Toshiba’s “Dynastron” line-up, is also the company’s first to integrate the enhanced sensitivity offered by back-side illumination technology (BSI). Sampling of the new sensor will begin in December and mass production will follow from the third quarter of 2010 (July--September).
BSI brings new levels of responsiveness to CMOS imaging. Lenses are deployed on the rear of the sensor on the silicon substrate, not on the front, where wiring limits light absorption. This positioning boosts light sensitivity and absorption by 40% compared to existing Toshiba products, and allows formation of finer image pixels.
Toshiba has made full use of the advantages of BSI to realize image pixels with a pitch of 1.4 microns, and to pack 14.6 million of them into a 1/2.3-inch sensor that meets the high level imaging and processing requirement, and that will also bring a new level of image quality to mobile phones. Toshiba will use the new sensor to promote its full-scale entry to the digital camera market, and will continue to develop BSI products as a mainstream technology.
The new sensor will be mass produced at Toshiba’s Oita Operations, on industry leading 300mm wafer lines deploying 65nm process technology. Initial production will be at a volume of 500,000 sensors a month.
CMOS image sensors are a focus product of Toshiba’s System LSI business. Until now, their main application has been in mobile phones, where Toshiba could leverage its high density integration and low power consumption technologies. With the introduction of BSI CMOS sensors, Toshiba will reinforce the sensor business by expanding application to include digital cameras.
Optical format: 1/ 2.3 inch
Number of pixels: 14.6 mega pixels
Size of pixels: 1.4 micro meter
Frame rate: 60 frame per sec. (Supports 1080p, 720p)
Toshiba Electronics Europe (TEE) is the European Headquarters for the electronic components business of Toshiba Corporation, which is the world’s fourth largest semiconductor vendor according to estimates by Dataquest.
Providing design, manufacturing, marketing and sales, TEE was formed in 1973 in Neuss, Germany. The company now has headquarters in Düsseldorf, Germany and subsidiaries in France, Italy, Spain, Sweden and the United Kingdom. Company president is Mr. Hitoshi Otsuka and the total number of personnel in Europe is around 300.
Toshiba Electronics Europe offers one of the industry’s broadest IC and discrete product lines including high-end memory, microcontrollers, ASICs, ASSPs and display products for automotive, multimedia, consumer, telecoms and networking applications. The company also has a wide range of power semiconductor solutions.
Toshiba Corporation is a leader in information and communications systems, electronic components, consumer products and power systems. The company’s integration of these wide-ranging capabilities assures its position as an innovator in advanced components, products and systems. Toshiba operates a global network of more than 730 companies, with 199,000 employees worldwide and annual sales surpassing US$67 billion.
For more company information visit Toshiba’s web site at www.toshiba-components.com
Toshiba Electronics Europe, Hansaallee 181, D-40549 Düsseldorf, Germany
Tel: +49 (0) 211 5296 0 Fax: +49 (0) 211 5296 792197
Note: The above text is the public part of the press release obtained from the manufacturer (with minor modifications). EETimes Europe cannot be held responsible for the claims and statements made by the manufacturer. The text is intended as a supplement to the new product presentations in EETimes Europe magazine.