LONDON – MiraMEMS Sensing Technology Co. Ltd. (Suzhou, China) is offering a three-axis capacitive linear accelerometer part numbered MM3A310. The component includes a surface micromachined sensor element and an ASIC signal conditioning and interface die, packaged in a 3-mm by 3-mm by 1-mm land grid array, according to the company's website, which is primarily in Chinese.
Specifications show that the part offers a user-selectable full scale of ±2g/ ±4g/ ±8g/ ±16g measurement range with data output rate from 1Hz to 4-kHz with signal condition, temperature compensation, self-test, free fall detection and a 96-entry deep data output FIFO on-chip.
The sensor element is fabricated using a deep reactive ion etch process and is protected from the environment with a hermetically sealed silicon cap, the company states. The device is rated over a temperature range of -40 degrees C to +85 degrees C and offers two independent interrupts to simplify various motion detection modes. Standard I2C and SPI interfaces are offered to communicate with the chip with requires a supply voltage of between 1.7-V and 3.6-V.
The company states on its website that the accelerometer is suitable for applications in mobile phone, personal music player user interfaces, pedometer for display orientation and gesture recognition, free-fall detection, double-click detection, vibration monitoring, inclination and tilt sensing.
According to online reports MiraMEMS was founded in 2011.
The so-called Suzhou Nanopolis is attempting to provide a complete infrastructure for nanotechnology and it is in the process of setting up a 6-inch MEMS pilot production facility in Suzhou operated under the auspices of the Suzhou Institute of Nano-Tech and Nano-Bionics (Sinano) of the Chinese Academy of Sciences. This pilot production is due to be up by the end of 2012 and serve as a resource for regional, national and international MEMS industry development