OTTAWA TechOnline analysts reveal a list of who's who inside iPhone 3G, getting under the phone's skin and peeking at the works.
As previously reported, those inside the new iPhone 3G include Samsung, Triquint Semiconductor, SST, Infineon and others.
While none of those chip vendors are allowed to announce their big design wins due to their non-disclosure agreement with Apple, the video below identifies the sources.
The video is divided in two parts: In Part 1, we look at the main board and see just how much TriQuint and Infineon won out on the new iPhone, as well as how Apple stuck with what worked on the original iPhone.
In Part 2, we show why we think Apple may be pulling away from prior deals with Samsung in favor of other memory suppliers, while also exposing who's supplying the Wi-Fi and Bluetooth capability for the new iPhone (hint: no surprises here).
David Patterson, known for his pioneering research that led to RAID, clusters and more, is part of a team at UC Berkeley that recently made its RISC-V processor architecture an open source hardware offering. We talk with Patterson and one of his colleagues behind the effort about the opportunities they see, what new kinds of designs they hope to enable and what it means for today’s commercial processor giants such as Intel, ARM and Imagination Technologies.