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Understanding dissipation, thermal resistance, and IC temperature (Part 2 of 2)

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re: Understanding dissipation, thermal resistance, and IC temperature (Part 2 of 2)
Allen10   11/2/2007 6:30:25 PM
This data, while well intentioned in suspect: Experimental technique: you could certainly have connected Kelvin leads to the test board (if not to the chip directly) and gotten better, more believeable, measurements. Lack of data: the plots of enable current v. Temp are too good. The actual measurements need to be plotted, not just the fitted line. Application: Who has 30x30 mm or more to heat sink a tiny SC70 package? What PCB layout did the designer specify for the specd 240C/W? What about lot-to-lot variation? Finally, I'd like to see the designer of this chip comment on the methods and results.

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