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CMOS is the right technology for 3G handset PAs

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XRF
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re: CMOS is the right technology for 3G handset PAs
XRF   2/19/2010 7:05:54 PM
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Silicon has a reputation of offering the best $ value to the end customer. It has the highest integration capability in the semiconductor industry. Many PA designs, C-MOS or GaAs, have several C-MOS devices around them now. So the real argument is can GaAs close the high level of integration offered by Silicon today. The only drawback is the die shrink which occurs during the lifetime. Power scale does not easily shrink without reliability issues. Overall silicon has the advantage over GaAs even though GaAs can integrate RF matching networks in a smaller scale. Power handling and reliability capabilities of these will need more research from both technologies.

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