Design Con 2015
Breaking News
Design How-To

CMOS is the right technology for 3G handset PAs

NO RATINGS
More Related Links
View Comments: Newest First | Oldest First | Threaded View
XRF
User Rank
Rookie
re: CMOS is the right technology for 3G handset PAs
XRF   2/19/2010 7:05:54 PM
NO RATINGS
Silicon has a reputation of offering the best $ value to the end customer. It has the highest integration capability in the semiconductor industry. Many PA designs, C-MOS or GaAs, have several C-MOS devices around them now. So the real argument is can GaAs close the high level of integration offered by Silicon today. The only drawback is the die shrink which occurs during the lifetime. Power scale does not easily shrink without reliability issues. Overall silicon has the advantage over GaAs even though GaAs can integrate RF matching networks in a smaller scale. Power handling and reliability capabilities of these will need more research from both technologies.

Radio
LATEST ARCHIVED BROADCAST
EE Times Senior Technical Editor Martin Rowe will interview EMC engineer Kenneth Wyatt.
Top Comments of the Week
Like Us on Facebook

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Times on Twitter
EE Times Twitter Feed
Flash Poll