In switched-mode power supply systems or other circuits used in power electronics, the demand for control circuitry to use fine-pitch SMD components is ever increasing. At the same time, however, high currents of more than 100A will be present across the printed circuit board. Product developers face the challenge of finding a suitable yet financially viable solution.
In power electronic systems, the PCBs used often involve challenging technical requirements that force product developers to come up with particularly creative solutions to meet these requirements. Engineering compromises in key areas have to be made, since the sensitive control circuits normally have to use standard inexpensive SMD components. This calls for fine-pitch structures for the wiring and land pattern for the components, microcontroller and FPGAs. But this requirement often conflicts with the need to dissipate heat.
Wirelaid technology as a compromise
A new technology available from a number of manufacturers such as Jumatech, Häusermann, or others is wirelaid technology. Here, a wire with a rounded or rectangular cross-sectional area is integrated into the stackup design directly beneath the outer layer.
For the complete article, which includes micro-welding, the stacking process with wirelaid technology, heatsink requirements, and software tool use, click here, courtesy of Automotive Designline Europe.
David Patterson, known for his pioneering research that led to RAID, clusters and more, is part of a team at UC Berkeley that recently made its RISC-V processor architecture an open source hardware offering. We talk with Patterson and one of his colleagues behind the effort about the opportunities they see, what new kinds of designs they hope to enable and what it means for today’s commercial processor giants such as Intel, ARM and Imagination Technologies.